Lead-Free / RoHS 3 Compliant / REACH Compliant
Through hole solder-in breadboard.
Plated through holes on 0.1" matrix. Hole pitch of 2.54mm (0.1") center-to-center. Pads are 2.0mm (0.079") round in size. Space between pads is 0.54mm (0.021").
15 rows, 6 columns.
Dimensions: 0.7" x 1.75" x 0.0625"
PCB construction: FR-4 UL94V-0. PCB operating temperature range: -40C to +130C. PCB reflow maximum temperature: +260C.
Hole size: 1.0mm (40 mils) diameter. Holes accept 25 mil square wire wrap posts.
Through hole solder-in breadboard.
Plated through holes on 0.1" matrix. Hole pitch of 2.54mm (0.1") center-to-center. Pads are 2.0mm (0.079") round in size. Space between pads is 0.54mm (0.021").
15 rows, 6 columns.
Dimensions: 0.7" x 1.75" x 0.0625"
PCB construction: FR-4 UL94V-0. PCB operating temperature range: -40C to +130C. PCB reflow maximum temperature: +260C.
Hole size: 1.0mm (40 mils) diameter. Holes accept 25 mil square wire wrap posts.